According to Odaily, the U.S. Department of Commerce has announced the initiation of a funding competition worth up to $1.6 billion. This initiative, led by the Biden-Harris administration, aims to accelerate the development of advanced semiconductor packaging technology in the United States.
The competition is part of a broader effort to enhance the country's semiconductor capabilities, which are crucial for various industries, including electronics, automotive, and defense. By investing in advanced packaging technologies, the administration seeks to strengthen the domestic semiconductor supply chain, reduce dependency on foreign sources, and bolster national security.
This funding initiative is expected to attract significant interest from companies and research institutions involved in semiconductor technology. The goal is to foster innovation and collaboration, ultimately leading to the development of cutting-edge packaging solutions that can support the next generation of semiconductor devices. The competition underscores the administration's commitment to maintaining the United States' leadership in technology and innovation.
