#hardwarebottleneck
hardwarebottleneck
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$FET GETS A MAJOR CATALYST FROM NEW HBM STANDARD 🚀
JEDEC's new SPHBM4 standard shifts HBM memory away from expensive silicon interposers and into standard organic substrates. This directly benefits the entire AI chip supply chain by relieving the advanced packaging bottleneck. Memory can now sit 20 mm from the GPU using high-speed serial channels, dramatically increasing substrate area per chip.
The shift will drive demand for high-density 20- to 28-layer ABF substrates and accelerate glass substrate adoption. SemiAnalysis states "the prosperity of substrates is just beginning" — a structural tailwind for hardware-focused projects in crypto. Which AI layer are you positioned on?
Not financial advice. Always manage your risk.
#FET #AICrypto #HardwareBottleneck #Semiconductors #CryptoAnalysis
🔥
JEDEC's new SPHBM4 standard shifts HBM memory away from expensive silicon interposers and into standard organic substrates. This directly benefits the entire AI chip supply chain by relieving the advanced packaging bottleneck. Memory can now sit 20 mm from the GPU using high-speed serial channels, dramatically increasing substrate area per chip.
The shift will drive demand for high-density 20- to 28-layer ABF substrates and accelerate glass substrate adoption. SemiAnalysis states "the prosperity of substrates is just beginning" — a structural tailwind for hardware-focused projects in crypto. Which AI layer are you positioned on?
Not financial advice. Always manage your risk.
#FET #AICrypto #HardwareBottleneck #Semiconductors #CryptoAnalysis
🔥
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