TSMC: Silicon photonics mainstream for optical transceivers; market share could exceed 50% by 2027
TSMC VP of advanced packaging technology Xu Guojin said optical-transceiver architectures are undergoing a structural shift and silicon photonics has become the mainstream. He expects silicon photonics could exceed 50% market share by 2027, will ultimately take the form of co-packaged optics (CPO), and some vendors will begin volume production in H2 this year.
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TSMC VP of advanced packaging technology Xu Guojin said optical-transceiver architectures are undergoing a structural shift and silicon photonics has become the mainstream. He expects silicon photonics could exceed 50% market share by 2027, will ultimately take the form of co-packaged optics (CPO), and some vendors will begin volume production in H2 this year.
@neurophos coded