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Japanese semiconductor manufacturer Rapidus announced the launch of the Rapidus CORE “Design Solution Alliance.” By connecting international design firms with IT service partners, the company provides technical support from front-end design through back-end manufacturing, aiming to secure orders for global 2-nanometer wafer semiconductor processes.

Rapidus CORE Design Solution Alliance connects global IT design partners

Semiconductor development relies heavily on coordinating people and expertise across research institutions, EDA (electronic design automation), intellectual property, chip design, manufacturing, and other areas. In response to the global semiconductor talent shortage, Rapidus established the Rapidus CORE Design Solution Alliance to help customers with limited technical resources complete chip designs at an early stage, streamline technology transfer, and gradually build a comprehensive supply chain infrastructure.

The founding members of the alliance include AION Silicon Limited; Cadence Design Systems, Inc.; Dai Nippon Printing Co., Ltd.; GreatAsic Technology Sdn. Bhd.; HCL Technologies Limited; Infinecs Systems Sdn. Bhd.; Infosys Limited; MavissDesign Co., Ltd.; MosChip Technologies Limited; NSW Inc.; Oppstar Technology Sdn Bhd; Quest Global Services Pte. Ltd.; SkyeChip Berhad; Synopsys, Inc.; TOPPAN Inc.; Toshiba Information Systems (Japan) Corporation; and Wipro Limited, among others.

Challenges in the Advanced-Node Foundry Market

Japan views Rapidus as the national team tasked with revitalizing its semiconductor industry. The company aims to begin mass production of 2-nanometer chips at its factory in Chitose, Hokkaido, in the second half of fiscal year 2027. Rapidus’s key technology partner is U.S.-based IBM. Despite receiving approximately US$19 billion in funding from the Japanese government and collaborating with IBM and imec (the Interuniversity Microelectronics Centre in Belgium) on technology, the company’s biggest challenge remains securing customers for its production lines.

Unlike established foundries such as TSMC (2330), Samsung, and Intel, which already hold significant market shares, Rapidus still faces challenges involving production stability, yields, and the costs customers incur when switching foundries.

Key Takeaways from This Article

Ecosystem established: Rapidus launched the Rapidus CORE global ecosystem, initially partnering with global EDA, IP, and design services companies to supplement customers’ design capabilities.

Mass production plans: The company plans to begin mass production using its 2-nanometer advanced process at its Chitose factory in Hokkaido in the second half of fiscal year 2027, using technology from IBM and imec.

Market expansion challenges: Although it has received substantial funding from the Japanese government, the company has not yet announced any confirmed mass-production orders. As it competes with rivals such as TSMC and Samsung, customers’ willingness to switch foundries and the stability of production-line yields will be key indicators to watch.

This article, “Rapidus Announces CORE Alliance, Joining Forces with Global IT Design Partners to Compete in the 2-Nanometer Chip Market,” first appeared on .