ChainCatcher message: On August 21, the 3D in-memory computing chip company Qianhe Yibang announced that its independently developed world’s first 4-layer 3D DRAM stacked in-memory computing chip has successfully returned to the wafer and powered on, indicating that the technology has moved from verification to engineering deployment. The chip uses a three-dimensional integrated native computing architecture. Compared with traditional solutions, its data access and memory bandwidth improves by an order of magnitude, while its memory access power, latency, and per-data-processing cost each decrease by an order of magnitude.

Qianhe Yibang was founded in January 2024 and was incubated by NetEase. It has recently completed more than RMB 2 billion in Series B financing.