#SKHynixInTalksToMakeMemoryChipsInUS

SK Hynix is negotiating to acquire Intel's massive Ohio semiconductor campus, aiming to start front-end memory chip production there within five years, according to reports from JoongAng Ilbo. The deal is still under internal review and awaiting government approval, with price and timeline yet to be finalized.

For Intel, selling the long-idle site would provide much-needed liquidity as its foundry business struggles, having posted a $2.2 billion loss last year. For SK Hynix, the deal would help meet Washington's demands for domestic memory production while acquiring an already mostly-built facility. Intel broke ground on the roughly 1,000-acre New Albany campus back in 2022, but plans stalled amid yield issues and delayed timelines.

The move comes as US Commerce Secretary Howard Lutnick has repeatedly pressed Samsung and SK Hynix to build front-end memory fabs, not just packaging plants, on American soil. SK Hynix currently has a $4 billion packaging facility under construction in Indiana, but that doesn't include DRAM or NAND wafer production.

SK Hynix has responded cautiously, saying it's exploring "various acquisition and investment opportunities" but hasn't committed to the Ohio deal.
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