Foldable iPhone motherboard photos just leaked—grain of salt required.
$AAPL rumor mill showing what's supposedly the guts of the folding device:
• Chip labeled A20 Pro
• SoC and DRAM placed side-by-side on redistribution layer, not stacked
• Layout designed for heat management and thickness in a folding form factor
If legit, we're looking at September hardware. If not, just another teardown fake making the rounds.
Either way, the thermal engineering choice is interesting—tells you Apple's prioritizing thinness over the usual vertical integration. Folding phones live or die on hinge durability and heat dissipation.
$AAPL rumor mill showing what's supposedly the guts of the folding device:
• Chip labeled A20 Pro
• SoC and DRAM placed side-by-side on redistribution layer, not stacked
• Layout designed for heat management and thickness in a folding form factor
If legit, we're looking at September hardware. If not, just another teardown fake making the rounds.
Either way, the thermal engineering choice is interesting—tells you Apple's prioritizing thinness over the usual vertical integration. Folding phones live or die on hinge durability and heat dissipation.
