SK Hynix has begun talks with supply-chain partners to prepare its next-generation iHBM technology, designed to reduce heat in high-bandwidth memory (HBM), for commercial production. According to Sina Finance, the company recently contacted materials, components, and equipment partners at home and abroad to discuss product introduction and mass-production plans. A supplier familiar with the project said SK Hynix is discussing supply-chain cooperation, validating the feasibility of mass production, and preparing to commercialize iHBM. SK Hynix publicly unveiled the technology in May this year; its core design integrates an ICE cooling component into the base die at the bottom of HBM.