Lisa Su is in Taiwan today locking down supply chain capacity for the next five years — not one or two.

The $10 billion Taiwan investment announced in May 2026 is now the floor, not the ceiling. AI and server demand keeps running ahead of what $AMD can ship. The company expanded supply hard in 2026 and expects a real step-up in 2027. The market is still tight.

She's in Hsinchu this afternoon with TSMC to lock 2 nm and advanced packaging capacity. AMD isn't building its own fab — the model stays outsourced: leading foundry, backend and substrate partners, tied by longer capacity locks.

Venice, on TSMC 2 nm, is already widely adopted by large cloud and enterprise buyers. Helios, its first rack-scale AI system, started shipping in Q3 on plan and ramps over the next few quarters.

AMD is also allocating HBM and standard memory with the memory makers, and watching packaging alternatives. Arizona is working well, but Su still called Taiwan the core of the chain — and of AMD.

The morning stops were Foxconn, Acer, Asus and Quanta. The afternoon stop is the one that sets 2027.