🚀 South Korea’s President Lee: Samsung’s $4.5B HBM packaging plant in Asan will unlock ~$30B more in advanced equipment investment. Line starts June 2028—1 year early—to power the AI boom. Mega-project momentum is real!
#Samsung #HBM #AIChips #Semiconductors #SouthKorea #TechInvestment
#Samsung #HBM #AIChips #Semiconductors #SouthKorea #TechInvestment
