According to Sina Finance, Nvidia CEO Jensen Huang will meet Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won again in New York on the 28th local time, about two months after their July meeting in San Francisco.

Industry attention is focused on high-bandwidth memory, or HBM. The article said HBM has become a core component for Nvidia's next-generation products, and that sixth-generation HBM4 has been applied to Vera Rubin, which Nvidia began mass production of this year.

The report said Samsung Electronics and SK Hynix are also working on joint development and optimization of later products, including seventh-generation HBM4E and eighth-generation HBM5. It added that Samsung Electronics is accelerating cooperation with Nvidia in this area, and that the two sides discussed long-term collaboration on next-generation HBM during Huang's visit to South Korea in June.

The New York meeting may also involve foundry services and advanced packaging, which the article described as Samsung's strengths.