$TSM just locked in $2B with GlobalFoundries — not for logic, for the piece underneath.
Silicon interposers. The quiet layer inside CoWoS.
GF will expand its Malta, NY fab to supply interposers for TSMC's advanced packaging line, starting volume production in H1 2028. Five-year deal. First U.S.-based interposer production at scale.
GF's CMOS SVP Ed Kaste said it plainly: advanced packaging is now the bottleneck for AI performance, power efficiency, and scale. They want a trusted domestic source so customers aren't stuck on one geography.
CoWoS assembly stays with TSMC. The interposer layer gets a second address — in New York, two years out.
If the interposer is tight enough to justify a $2B lock-in, what else in that package stack is still single-sourced?
Packaging is the new chokepoint. Supply chain diversification is moving upstream.
Silicon interposers. The quiet layer inside CoWoS.
GF will expand its Malta, NY fab to supply interposers for TSMC's advanced packaging line, starting volume production in H1 2028. Five-year deal. First U.S.-based interposer production at scale.
GF's CMOS SVP Ed Kaste said it plainly: advanced packaging is now the bottleneck for AI performance, power efficiency, and scale. They want a trusted domestic source so customers aren't stuck on one geography.
CoWoS assembly stays with TSMC. The interposer layer gets a second address — in New York, two years out.
If the interposer is tight enough to justify a $2B lock-in, what else in that package stack is still single-sourced?
Packaging is the new chokepoint. Supply chain diversification is moving upstream.