Musk's Terafab is already in talks with Korean materials and equipment suppliers — NDAs are being signed around a million-wafer target.

The question now: does real volume still hinge on Intel and TSMC process partnerships, or can the materials side scale independently?

If the supply chain is moving this fast, the bottleneck may not be equipment — it may be process validation and yield ramp timelines. Watch how quickly partnerships formalize. That's the real signal.

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