TSMC's 2nm ramp is only the beginning. N2 is now in volume production, with N2P and A16 scheduled for the second half of 2026.

The real shift isn't just about smaller transistors anymore. AI chips now require HBM, chiplets, and advanced packaging like CoWoS and CoPoS. A16 will introduce backside power delivery because the constraint has become power efficiency, not just raw speed.

Capex guidance for this year was raised to $60–64 billion — a clear signal of where the industry is headed.

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