Samsung is aggressively vertically integrating across the AI data center stack — from photonics to thermal cooling.

Recent moves:
• Bloomberg reports Samsung is in talks to acquire $MOD (Modine), a key supplier of thermal/cooling infrastructure for AI data centers
• Samsung just bought silicon photonics patents from bankrupt Rockley Photonics (modulators, PICs, design/integration IP)
• Earlier leaks suggested Samsung eyeing more silicon photonics targets
• Samsung reportedly aims to produce optical engines and PICs by 2027, CPO services by 2029

This mirrors the $MRVL/$LITE deal and reflects a broader trend: hyperscalers and chip giants are buying up collapsed upstream suppliers at distressed valuations.

Many of these smaller photonics, thermal, and interconnect companies got crushed in the recent selloff despite being strategically critical to AI infrastructure buildout.

Expect more M&A as big players lock in supply chains and capture margin at fire-sale prices. If you're hunting asymmetric upside, watch distressed AI infrastructure plays that could become acquisition targets.