Musk’s Terafab project plans to reach monthly wafer capacity of about 1 million by 2032. According to Sina Finance, Terafab told equipment makers this fall that it plans monthly capacity of about 700,000 memory-chip wafers and more than 300,000 computing semiconductor wafers. Its planned total capacity would be about 40 times that of Rapidus’s factory in Chitose, Hokkaido, Japan, which is designed for 25,000 wafers per month. The planned memory capacity is comparable to Samsung’s current total DRAM capacity of about 650,000 to 700,000 wafers per month.

Details of Terafab’s memory manufacturing plans remain unclear. The project has not disclosed how planned memory capacity would be divided between HBM and LPDDR, or whether DRAM chips would be developed, manufactured and stacked in-house or partly sourced as bare dies for packaging. Terafab is reportedly discussing external technology partnerships to support manufacturing. Intel will provide technical support for logic-chip production, with plans to use its 2nm and 1.4nm processes.

Terafab has begun preliminary equipment procurement work. Its procurement team made a private visit to Japan earlier this month, seeking equipment deliveries from some suppliers within months while installation proceeds, with mass production targeted for the second half of 2028. Building an advanced wafer fab and bringing it to mass production typically takes more than three years, and reducing defect rates and achieving stable production take additional time after equipment arrives.