Major semiconductor equipment makers are nearing completion of supply contracts for 2028, with some also discussing purchase orders for equipment available in 2029. According to ChainCatcher, South Korea’s Electronic News reported on November 3 that Applied Materials, ASML, Lam Research, Tokyo Electron and KLA are among the companies in the final stages of contract discussions.

Demand to install front-end manufacturing equipment in fabs quickly has surged. Key equipment partners of TSMC, Micron and Intel are developing supply strategies for 2029, while some South Korean equipment companies that deal directly with overseas manufacturers are reviewing supply plans two to three years ahead.

Contract talks typically begin six to 12 months before equipment is installed, and delivery takes about three to six months after an order is placed. Ongoing AI infrastructure investment and large-scale spending by semiconductor manufacturers have more than doubled equipment delivery times compared with normal levels; lead times for some categories exceed two years. As a result, contracts are being advanced by one to two years. ASML said last month that it expects no interruption in lithography equipment supply through 2028 and is studying options to expand future capacity.

A global equipment executive said discussing supply three years ahead is unusual and expected the trend to continue through 2030. Another industry source said early equipment commitments could spread to back-end manufacturing as front-end and back-end investment proceed in parallel. Samsung Electronics and SK hynix are continuing fab investments and may need to secure core process equipment earlier.