ChangXin is on the rise!! Tremble!
CXMT has overcome challenges in advanced process nodes and advanced packaging with high-aspect-ratio TSV silicon vias, and plans to officially begin small-scale trial production of next-generation high-bandwidth memory, HBM3E, within the next two months. $MUB
CXMT has overcome challenges in advanced process nodes and advanced packaging with high-aspect-ratio TSV silicon vias, and plans to officially begin small-scale trial production of next-generation high-bandwidth memory, HBM3E, within the next two months. $MUB