BlockBeats News, October 14 — According to South Korean media reports, delivery of some of SK Hynix’s HBM4 back-end process equipment orders originally scheduled for this year may be postponed until next year. Industry observers believe this reflects an adjustment to the company’s pace of HBM4 capacity expansion, but is not enough to indicate a full-scale delay to the HBM4 project. Sources said that most of SK Hynix’s HBM4-related equipment orders for this year have largely been finalized, but plans for follow-up investment remain unclear. Although some equipment has been delivered, it has not yet been fully brought into operation. There has also been market speculation about HBM4 technology or yield rates, but there is currently no evidence directly linking delayed equipment deliveries to product quality issues. Analysts suggest the adjustment may be related to a recovery in the general-purpose DRAM market. As demand for and prices of general-purpose DRAM rise, SK Hynix may redirect some investment toward expanding related capacity. At the same time, the company continues to advance HBM4 research and development and its advanced packaging rollout, and has already provided major customers with 16-layer HBM4 samples.