动察 Beating AI News Flash: According to people familiar with the matter, Broadcom's Wall Street underwriting syndicate is working to raise $60 billion in new AI chip financing, with beneficiaries including Anthropic and other companies.Sources said that multiple banks involved in this massive debt package are about to issue underwriting invitation letters for $42 billion in Class A senior secured debt. The sources said Blackstone Group is leading $18 billion in Class B subordinated debt, with multiple Blackstone funds committing $9 billion, and the remaining portion is planned for external distribution. A Broadcom spokesperson declined to comment.
