LG Electronics has unveiled a modular solution that preassembles data center cooling equipment such as pumps and pipes inside containers before delivering it to customers. According to Sina Finance, the company said the approach can reduce on-site construction and allow cooling capacity to be added in stages as server expansion needs grow.

LG Electronics first displayed its Hydronic Modular liquid-cooling solution at the 2026 Asia Data Center Exhibition, which opened in Singapore on the 29th. The system preassembles pumps and valves for circulating chilled water, emergency buffer tanks, pipes, and other equipment inside containers built to International Organization for Standardization container specifications. At the data center site, the cooling system can be built by connecting the chiller unit to the container module through pipes.