NVIDIA is collaborating with Intel and partners in AMD’s supply chain to develop a glass-substrate technology aimed at overcoming the limitations of packaging AI chips related to size, thermal dissipation, and high-speed interconnections.
SCHMID stated that glass substrates could enable the large-scale integration of high-bandwidth memory (HBM), thereby increasing integration density and the data-transmission capabilities of next-generation GPUs. However, the metallization process for glass through-vias (TGV) remains a technical hurdle, and customer certification procedures are not yet completed.
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SCHMID stated that glass substrates could enable the large-scale integration of high-bandwidth memory (HBM), thereby increasing integration density and the data-transmission capabilities of next-generation GPUs. However, the metallization process for glass through-vias (TGV) remains a technical hurdle, and customer certification procedures are not yet completed.
$NVDA
$ZEC
$H