Intel CEO says that with such strong CPU demand, the company can only serve 50% of its customers.
Chen Liwu said that CEOs are urging an apology for not being able to produce enough chips, because Intel is working full force to expand its manufacturing capacity.
Intel is trying to produce enough processors to meet the surge in demand. CEO Lin Bin said the company can currently supply only half of the quantity its customers require.
“With CPU demand this high, we can only meet 50% of customer needs,” he said while speaking with Cisco President Jeetu Patel at the Splunk meeting in Denver.
According to reports, Intel has obtained a recent patent that is the first to embed Micro LED into a glass substrate to achieve deep optoelectronic integration. To break through the bottleneck in AI interconnects and capture spillover orders for TSMC’s CoWoS, it has reportedly teamed up with AUO, which has strong advantages in glass process technology. If the cooperation is implemented, it will help Intel establish differentiated advantages in the AI compute packaging arena, while also enabling AUO’s key transformation from display panels to high-value advanced packaging.
Intel is extending its advanced packaging strategy into the Micro LED substrate field, and it is rumored to be entering deep cooperation with AUO Optoelectronics, a major Taiwan panel maker, to jointly promote solutions for integrating CPO (co-packaged optics) and high-density computing chips. This marks that the optoelectronic heterogeneous integration technology route is accelerating toward commercialization.
During the U.S. stock after-hours session on Monday night, Intel rose more than 5% to $114.16. $INTC
Chen Liwu said that CEOs are urging an apology for not being able to produce enough chips, because Intel is working full force to expand its manufacturing capacity.
Intel is trying to produce enough processors to meet the surge in demand. CEO Lin Bin said the company can currently supply only half of the quantity its customers require.
“With CPU demand this high, we can only meet 50% of customer needs,” he said while speaking with Cisco President Jeetu Patel at the Splunk meeting in Denver.
According to reports, Intel has obtained a recent patent that is the first to embed Micro LED into a glass substrate to achieve deep optoelectronic integration. To break through the bottleneck in AI interconnects and capture spillover orders for TSMC’s CoWoS, it has reportedly teamed up with AUO, which has strong advantages in glass process technology. If the cooperation is implemented, it will help Intel establish differentiated advantages in the AI compute packaging arena, while also enabling AUO’s key transformation from display panels to high-value advanced packaging.
Intel is extending its advanced packaging strategy into the Micro LED substrate field, and it is rumored to be entering deep cooperation with AUO Optoelectronics, a major Taiwan panel maker, to jointly promote solutions for integrating CPO (co-packaged optics) and high-density computing chips. This marks that the optoelectronic heterogeneous integration technology route is accelerating toward commercialization.
During the U.S. stock after-hours session on Monday night, Intel rose more than 5% to $114.16. $INTC
