Just finished my second expert call — this time with a Samsung HBM packaging engineer who specializes in hybrid bonding.

Came away with some genuinely useful insights.

We went deep on:
• When (or if) the hybrid bonding transition actually happens
• The real technical challenges standing in the way
• How to think about $BESI through this shift

Got into the weeds on all of it. Should make for a solid read.

Report drops on Substack next week. ✌️