According to Sina Finance, Samsung Electronics has opened an advanced semiconductor packaging research and development center in Yokohama, Japan. Samsung previously said it plans to invest about 40 billion yen over five years starting in 2024 to expand the lab's research infrastructure and strengthen advanced packaging technology. Advanced Package Lab will work with Japanese companies, universities, and research institutions to jointly develop next-generation packaging materials and processes. Samsung plans to staff the center with more than 100 researchers by 2027.