Google has decided to adopt Intel's EMIB packaging for its TPU, and the first TPU using the technology has already met yield targets. According to ChainCatcher, the technology, cost, and capacity performance all meet Google's original standards, increasing the likelihood that future TPU generations will continue using EMIB.

With TSMC's CoWoS capacity still tight, Google is expected to keep using EMIB as long as its yield and technical performance remain on target. MediaTek is also involved as a related ASIC partner, and its U.S. team includes some managers with Intel backgrounds, which has reportedly made cooperation smoother. While MediaTek still relies primarily on TSMC, its success with Intel on TPU could help strengthen Google's trust, win more projects, and offer cloud customers more packaging options.

TSMC has previously called on more suppliers to invest in advanced packaging to ease pressure on capacity. Supply-chain sources said TSMC's own expansion will not be unlimited, making diversified packaging routes such as Intel's a necessary direction. Testing equipment and interface suppliers are also expected to benefit.