SK Hynix is introducing advanced packaging technologies, including Intel EMIB, for its next-generation HBM solutions and plans to eventually move into the 3D packaging era. According to ChainCatcher, Packaging Engineering Vice President Jaesik Lee presented a report titled "Advanced Packaging for High Bandwidth Memory" at the 2026 Hot Chips conference, outlining how the company intends to use advanced packaging to accelerate its HBM product roadmap.

SK Hynix is also exploring methods such as hybrid bonding to break through the 16-layer stacking limit. The company plans to address power consumption challenges by increasing TSV counts, improving IO speed through logic process integration, and optimizing the power delivery network. SK Hynix shares in South Korea rose 1.71% at the time of writing.