The U.S. Department of Commerce recently announced plans to provide up to $389 million (approximately RMB 2.602 billion) in R&D funding to four companies through semiconductor research and development programs under the CHIPS and Science Act. Among them, fusion energy company Helion is eligible to receive up to $175 million (approximately RMB 1.17 billion) to develop high-voltage power semiconductors and advanced energy power modules in support of its fusion power generation system.

The other three companies are Commonwealth Fusion Systems, Vertical Semiconductor, and Sibelco, which are eligible to receive up to $85 million (approximately RMB 568 million), $73 million (approximately RMB 488 million), and $56 million (approximately RMB 375 million), respectively. Commonwealth Fusion Systems will use the funding to develop semiconductors, power electronics, embedded electronics for fusion diagnostics, and radiation-hardened electronic devices. Vertical Semiconductor will advance R&D on vertical gallium nitride (GaN) power semiconductors, with target applications including advanced computing equipment and AI data center racks. Sibelco will develop next-generation purification and finishing technologies for ultra-high-purity quartz.

This funding is part of a $10 billion (approximately RMB 66.882 billion) semiconductor R&D funding program approved by the U.S. Congress in 2022. As a condition of receiving the funds, the U.S. government will acquire minority equity stakes in each recipient company under the final funding agreements, but will have no control or voting rights.
#半导体 #核聚变 #AI数据中心 #美国科技政策 #CHIPS Act

Source: @inge_hou
https://x.com/inge_hou/status/2113577416371347502