As the computing demands of AI accelerators and the number of HBM stack layers continue to rise, thermal management has become one of the toughest technical challenges for HBM. According to an October 21 report by South Korean media outlet ETNews, SK hynix has recently contacted materials, component, and equipment companies in South Korea and abroad to discuss product integration and mass-production plans as it prepares to upgrade its iHBM technology and ramp up production. iHBM is targeted for introduction starting with HBM5, which SK hynix's roadmap projects will debut in 2029.
SK hynix begins iHBM supply-chain talks to pave the way for mass production
ETNews, citing industry sources, reported that SK hynix is in talks with materials, component, and equipment partners about iHBM applications in actual products and mass-production plans. Supply-chain sources said SK hynix is exploring cooperation with equipment and materials suppliers to integrate iHBM into actual manufacturing processes and commercialize it, while also assessing the feasibility of mass production. The launch appears to be imminent.
iHBM is a technology unveiled by SK hynix in May this year. As competition in HBM intensifies, this collaboration is also seen as a key move by SK hynix to maintain its leading position in the AI memory market.
Why is HBM vulnerable to heat? The base die is the biggest hotspot
Thermal management is one of the biggest technical challenges for HBM. In current HBM designs, the bottom layer is the base die, with stacked DRAM core dies above it, directly in contact. The base die contains physical connection areas that enable ultra-high-speed data transfer with the GPU. The greater the volume of data processing and the more layers stacked, the more severe the heat generated in these areas.
The problem is that this heat must pass through the core dies above before it can escape, reducing thermal management efficiency. If heat dissipation gets out of control, it can cause anything from a sharp drop in power efficiency to reduced performance, system errors, and a shorter lifespan. This is one of the main barriers to AI infrastructure performance, and why major HBM makers are focusing their R&D on heat dissipation.
How does iHBM dissipate heat? ICE opens up a new path, with thermal resistance expected to drop by 30%
What makes iHBM special is that the technology places an integrated cooling element, ICE, in the communication connection area of the base die, creating a separate path for heat to escape. ETNews previously reported that the design centers on placing thermally conductive but electrically insulating heat-dissipation materials around the connection areas where heat is concentrated.
SK hynix says the design can reduce thermal resistance by more than 30%, enabling HBM to operate reliably even in high-temperature, high-load environments and further improving AI infrastructure efficiency.
In terms of process, iHBM uses wafer-level packaging (WLP) based on Advanced MR-MUF, a process already adopted by SK hynix that fills the gaps in a single step after stacking HBM chips. As a result, its materials, components, and equipment supply chain is expected to be similar to that of current HBM. SK hynix is also evaluating ways to expand its supply chain by bringing in new partners that can improve iHBM performance and productivity.
Targeting HBM5, set to debut in 2029! Are Samsung and Micron keeping up?
SK hynix aims to introduce iHBM starting with HBM5. According to its HBM5 roadmap, the product is expected to launch in 2029, and the company is currently validating HBM5 using TSMC’s advanced CoWoS packaging technology. Industry insiders believe that as competitors accelerate technology upgrades and expand capacity, SK hynix is seeking to maintain its advantage in the next-generation market through technological differentiation.
Samsung and Micron have also identified this same hotspot. At COMPUTEX 2026, Samsung noted that D2D PHY is one of the main heat sources and said it is using HPB (Heat Path Block) to create a dedicated heat-dissipation path around the area. The technology is currently being validated for HBM4E, with plans to introduce it in HBM5. At Hot Chips 2026, Micron said that HBM heat dissipation is fundamentally about power density, not total power consumption, and that heat is most concentrated in the base die, where logic functions are densely packed.
The three major manufacturers have different approaches, but all focus on the thermal path design of the base die. The industry is watching for details on the validation and adoption of these technologies, their ramp-up timelines, and the list of iHBM suppliers.
This article is republished with permission from: (Chain News)
Original title: (SK hynix’s new heat-dissipation solution: “iHBM” launches supply-chain discussions, aiming for HBM5 adoption)
Original author: Crumax
The article “SK hynix launches iHBM supply-chain discussions, aiming for mass production in 2029 to capture HBM5 opportunities” was first published on “Crypto City”