Micron just mapped out its DRAM and NAND roadmap, betting on wafer bonding, new materials, and 3D DRAM while skipping the 4F2 cell its rivals are chasing. Custom HBM, vertical memory, and AI focused NAND are all in the works. Which move do you think matters most?
$MU
https://chippub.substack.com/p/microns-latest-dram-and-nand-roadmap