TSMC has completed development and validation of its angstrom-level A16 1.6nm process, with mass production expected to begin in the fourth quarter of 2026. According to ChainCatcher, the process uses TSMC's Super Power Rail back-side power delivery technology, which separates signal and power routing and places power lines on the back of the wafer to reduce bottlenecks.

Compared with its 2nm process, A16 is said to improve computing speed by 8% to 10%, cut power consumption by 15% to 20%, and increase chip density by 8% to 10%. TSMC views the 1.6nm process as a transition step toward 1.4nm, with 1.4nm mass production targeted for 2028.